NPCN-704

NPCN-704 epoxy resin is an o-cresol epoxy resin built on a heat-resistant benzene ring backbone with multifunctional epoxy groups. Its high bridging density and wide range of processing conditions make NPCN-704 epoxy resin a common choice for buyers who need a high-performance, heat-resistant epoxy chemistry rather than a general-purpose bisphenol-A grade.

NPCN-704 epoxy resin

Key Properties of NPCN-704 Epoxy Resin

  • O-cresol epoxy resin with a heat-resistant benzene ring backbone
  • Multifunctional epoxy groups deliver high bridging density after cure
  • Wide range of processing conditions due to its structural characteristics
  • Can be hardened with polyamine, phenolic, polyester resins, or acid anhydrides
  • Cured substrate offers a high Tg value with good heat and chemical resistance

Applications

Buyers source this resin for PC inks, composite materials, and powder coatings, as well as high-performance circuit board substrates (prepreg) where a high Tg value and strong heat and chemical resistance are required.

Selection Guide

NPCN-704 epoxy resin is the preferred choice when a formulation needs a heat-resistant, high-bridging-density epoxy backbone rather than a standard liquid epoxy resin. It can be hardened with a range of curing agents, including polyamine, phenolic, and polyester resins or different acid anhydrides, giving formulators flexibility to tune cure speed and final substrate performance. Our team can help confirm the right curing agent and processing window for a given application.

Why Sourcing Consistency Matters

For manufacturers producing circuit board substrates, powder coatings, or composite materials, consistent Tg and heat resistance batch to batch directly affects downstream processing and end-product reliability. Sourcing NPCN-704 epoxy resin from a supplier that documents COA and packaging details for every shipment helps buyers plan production schedules with fewer surprises.

Grade Comparison

Compared with general-purpose bisphenol-A epoxy resins, NPCN-704 epoxy resin’s o-cresol backbone and multifunctional epoxy structure give it a higher crosslink density after cure, which typically translates into better dimensional stability and heat resistance for demanding substrates. Buyers moving from a standard liquid epoxy resin to NPCN-704 epoxy resin should plan for its different processing window, review compatible hardener ratios, and confirm cure schedules with our technical team before scaling up production, particularly when targeting circuit board substrate or powder coating applications.

Where to Source NPCN-704 Epoxy Resin

Composite material buyers, chemical traders, and sourcing managers can access epoxy resin products including NPCN-704 through Thousands Technology’s supply chain resource support. For reference on chemical handling and classification standards used across the composites and electronics industries, buyers can also review ASTM standards and publications.

Packaging and Shipping

This epoxy resin is available in standard drums and IBC totes, with bulk supply options for large-volume buyers. Shipments go globally by sea and air freight, with COA and MSDS documentation provided for every order. Buyers should contact our team for current lead times and packaging options.

Frequently Asked Questions

What type of epoxy resin is NPCN-704?

It is an o-cresol epoxy resin with a heat-resistant benzene ring backbone and multifunctional epoxy groups, giving it a high bridging density after cure.

What curing agents work with NPCN-704 epoxy resin?

It can be hardened with polyamine, phenolic, or polyester resins, or different acid anhydrides, depending on the target cure speed and substrate performance.

What applications is NPCN-704 epoxy resin used for?

It is used in PC inks, composite materials, powder coatings, and high-performance circuit board substrates (prepreg) requiring a high Tg value and strong heat and chemical resistance.

Do you provide COA and MSDS with NPCN-704 shipments?

Yes, COA and MSDS documentation is provided with every shipment to support quality control and regulatory compliance requirements.

Ready to source NPCN-704 epoxy resin for your next production run? Contact our team with your target Tg and curing agent for grade confirmation and a supply quote.

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NPEB-400

Brand:NanYa
Physical State:Solid
Epoxy Equivalent Weight (g/eq):380~410
Soften point:64~74 ℃
Hydrolyzable chlorine(PPM):200 max
Br content:46~50%
Color (Gardner):1.0max

NPEF-170

Brand:NanYa
Physical State:Liquid
Epoxy Equivalent Weight (g/eq):160~180
Color (Gardner):3.0max
Flash Point (℃):150↑
Viscosity (cps,at 25 ℃):2000~5000
Density (g/cm3 25℃):1.16

NPEL-127

Brand:NanYa
Epoxy Equivalent Weight (g/eq): 176~184
Hydrolyzable chlorine( ppm):1000↓
Color(Gardner):0.0~1.0
Viscosity(cps,at 25 ℃) :8000~11000

NPEL-127E

Brand:NanYa
Epoxy Equivalent Weight (g/eq): 176~184
Hydrolyzable chlorine( ppm):300↓
Color(Gardner):0.0~1.0
Viscosity(cps,at 25 ℃) :8000~11000

NPEL-128

Brand:NanYa
Epoxy Equivalent Weight (g/eq): 184~190
Color (Gardner) :1.0max
Flash Point (℃) :150↑
Viscosity(cps,at 25 ℃) :12000~15000
Hydrolyzabie chlorine (ppm) :1000↓
Density (g/cm3 25℃) :1.16

NPES-901

Brand:NanYa
Epoxy Equivalent Weight (g/eq): 450~500
Color (Gardner):1.0max
Flash Point (℃):200↑
Softening point ( 25 ℃):64~74
Solution viscosity ( at 25 ℃):D~F
Density (g/cm3 25℃):1.18

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