Benefits
• Good thermal stability and flexibility
• Excellent chemical and hydrolysis resistance
• Low exotherm
Applications
Neobond® VE 6100-W-1 has been developed for the adhesion of laminates that are exposed to high dynamic loads at a broad range of temperatures. Due to its resilience and low exotherm thick layer applications are possible without crack building.
Neobond® VE 6100-W-1 combines good thermal stability and flexibility under dynamic loads. Further, this adhesive paste exhibits an excellent chemical and hydrolyses resistance. To prevent heavy shrink marks Neobond ® VE 6100-W-1 is equipped with a low exotherm system. For the benefit of machine
dosing a peroxide indicator has been incorporated. The rheology enables a bond line thickness on vertical walls from 1-20 mm without sagging. This product has been optimized to prevent skinning during curing. Standard MEKP-peroxide types can be used without the risk of air bubble.
