TYPICAL PROPERTIES OF UNCURED MATERIAL
| Specific Gravity @ 20 °C | 1.34 |
| Extrusion Rate, g/min: Pressure 0.62 MPa, time 15 seconds, temperature 25 °C: Semco Cartridge | 300 to 650LMS |
| Flash Point | See SDS |
Directions for Use
1. For best performance bond surfaces should be clean and free from grease.
2. Moisture curing begins immediately after the product is exposed to the atmosphere, therefore parts to be assembled should be mated within a few minutes after the product is dispensed.
3. The bond should be allowed to cure (e.g. seven days),before subjecting to heavy service loads.
4. Excess material can be easily wiped away with non-polar solvents.
