Palapreg® P 6028-901 is intended for SMC/BMC applications. It applies mainly to the high-end electronics market with excellent electrical properties. The parts show high resistance to heat deformation and moisture.
| Supplier | |
|---|---|
| Resin Type | Unsaturated Polyester Resin |
| Pre-promotion Thixotropy | TP |
| Molding Process | Hand Lay-up, Spraying |
| Industry | Automotive & Transportation, Building & Construction, Home Renovation, Marine Vessels |
Palapreg® P6028-901 is intended for SMC and BMC production. Used in combination with LS additives like Palapreg® H814-902, it is used for the manufacture of SMC/BMC parts characterized by low shrinkage, excellent surface smoothness and gloss, and a deep and uniform pigmentation. Good heat resistance even at high polystyrene levels can be achieved. Palapreg® P6028-901 can readily be thickened with magnesium oxide.
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