Neobond® VE 6100-W-1 feature excellent chemical and hydrolysis resistance and low exotherm properties.
| Supplier | |
|---|---|
| Resin Type | Vinyl Resin |
| Pre-promotion Thixotropy | / |
| Molding Process | Filament Winding, Hand Lay-up, Spraying |
| Industry | Automotive & Transportation, Building & Construction, Home Renovation, Marine Vessels, Petrochemical, Wind Energy |
• Good thermal stability and flexibility
• Excellent chemical and hydrolysis resistance
• Low exotherm
Neobond® VE 6100-W-1 has been developed for the adhesion of laminates that are exposed to high dynamic loads at a broad range of temperatures. Due to its resilience and low exotherm thick layer applications are possible without crack building.
Neobond® VE 6100-W-1 combines good thermal stability and flexibility under dynamic loads. Further, this adhesive paste exhibits an excellent chemical and hydrolyses resistance. To prevent heavy shrink marks Neobond ® VE 6100-W-1 is equipped with a low exotherm system. For the benefit of machine
dosing a peroxide indicator has been incorporated. The rheology enables a bond line thickness on vertical walls from 1-20 mm without sagging. This product has been optimized to prevent skinning during curing. Standard MEKP-peroxide types can be used without the risk of air bubble.
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