TYPICAL PROPERTIES OF UNCURED MATERIAL
Flash PointSee SDS
| Specific Gravity @ 25 °C | 1.1 |
| Viscosity, Brookfield – HBT, 25 °C, mPa·s (cP): Spindle TB, speed 0.5 rpm, Helipath | 700,000 to 1,700,000LMS |
| Viscosity, Brookfield – HBT, 25 °C, mPa·s (cP): Spindle TB, speed 5.0 rpm, Helipat | 150,000 to 375,000LMS |
Directions for Use
1. For best performance bond surfaces should be clean and free from grease.
2. The product is designed for close fitting flanged parts with gaps up to 0.25 mm (0.01 in).
3. Apply manually as a continuous bead or by screen printing to one surface of the flanges.
4. Low pressures (<0.05 MPa, <7.3 psi) may be used when testing to confirm a complete seal immediately after assembly and before curing.
5. Flanges should be tightened as soon as possible after assembly to avoid shimming.
