General
NPCN-704 is an o-cresol epoxy resin with a heat-resistant benzene ring backbone and multifunctional epoxy groups. It has a high bridging density and has a wide range of processing conditions due to its structural characteristics. NPCN-704 can be hardened with polyamine, phenolic, polyester resins or different acid anhydrides to produce high-performance circuit board substrates (prepreg) or composite materials. The substrate produced has a high Tg value and good heat and chemical resistance.
Application
- PC inks
- composite materials
- powder coatings
