BYK-A-535

Silicone-free air release additive for epoxy and PU systems, preventing foam, bubbles, and pinholes in plastics, coatings, adhesives, and food-contact applications.

Product Information

Silicone-free air release additive for solvent-borne and solvent-free epoxy and polyurethane systems.

Application:

• Ambient-curing Plastic Systems
Special Features and Benefits:Air release additive to prevent foam and bubbles during the manufacture and application of ambient-curing plastic applications. Particularly recommended for polyurethane-based floorings and casting systems (polymer concrete, mineral casting) that are based on epoxy resins. Suitable for materials that come into contact with food (including
drinking water).
• Adhesives & Sealants
Special Features and Benefits:BYK-A 535 is a defoamer for all solvent-borne and solvent-free adhesives and sealants. Particularly recommended for systems that are based on polyurethane and epoxy resins. BYK-A 535 may cause cloudiness in transparent systems.
• Coatings Industry
BYK-A 535 is particularly suitable for solvent-free systems such as polyurethane and epoxy coatings and for materials that come into contact with food (including drinking water). It prevents air bubbles and pinholes. BYK-A 535 may cause cloudiness in transparent systems.

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