| Supplier | |
|---|---|
| Resin Type | Epoxy Resin |
| Resin Features | Bisphenol A |
| Pre-promotion Thixotropy | / |
| Molding Process | Casting, Compression Molding, Filament Winding, Hand Lay-up |
| Industry | Automotive & Transportation, Building & Construction, Electrical & Electronics, Marine Vessels, Paints & Coatings, Wind Energy |
NPCN-704 is an o-cresol epoxy resin with a heat-resistant benzene ring backbone and multifunctional epoxy groups. It has a high bridging density and has a wide range of processing conditions due to its structural characteristics. NPCN-704 can be hardened with polyamine, phenolic, polyester resins or different acid anhydrides to produce high-performance circuit board substrates (prepreg) or composite materials. The substrate produced has a high Tg value and good heat and chemical resistance.
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