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Deawa®5213

Deawa®5213 Release Agent provides excellent performance in large demolding applications. It can be used for the release of the following materials: epoxy resin (thermoset resin, composite fiber materials), polyester materials, and thermoplastics.

Additional information

Supplier

Industry

Automotive & Transportation, Building & Construction, Electrical & Electronics, Home Renovation, Marine Vessels, Wind Energy

Additive Classification

Mold Release Agents

Characteristics

  • Easy release agent, multiple demolding
  • High surface gloss
  • No transfer
  • No residue
  • Low odor

Material Physical and Chemical Properties

Appearance Clear liquid
Odor Hydrocarbon
Solvent Aliphatic hydrocarbons
Specific gravity 0.760±0.010
Thermal stability after curing 400°C

Precautions

Sensitive to moisture, the lid should be tightly sealed when not in use. Ensure good air circulation during use.

Mold Preparation

For best results, deawa®5213 release agent should be applied on clean and dry molds. All waxes, sealants, scrubbers, and other release agent residues must be cleaned thoroughly. You can choose deawa®577S mold cleaner, deawa®553S mold cleaner, or other cleaning solvents for cleaning.

Application Method

(Refer to the product safety data sheet before use)Deawa®5213 release agent can be applied at room temperature using a clean, lint-free cloth (nonwoven fabric should not be used as Deawa’s solvent will dissolve the adhesive in nonwoven fabrics).
First, use a clean, lint-free cloth soaked with the release agent, and then apply it evenly and systematically to the mold surface. The requirement is to form a smooth and wet film, and then immediately use a clean, lint-free cloth to spread it from the outside in. Do not work on the mold surface immediately after wiping; wait for the release agent to fully cure before proceeding with production.
Generally, two layers or a thicker base coat are needed, with each layer requiring 5-10 minutes for the solvent to evaporate. The final layer needs 20 minutes to fully cure before starting production. Note: The base coat should be dry and non-sticky.
A better release effect is ensured when every tiny part of the mold surface has sufficient and even coverage of the release agent.
If release difficulty occurs, you can choose to reapply on the entire mold or only the problematic areas.

ZC-25

Brand:Polylite
Appearance:Light yellow transparent viscous liquid
Acid Value:14-20mgKOH/g
Viscosity,25℃:0.14-0.16Pa.s
Solid Content:52-58%
Gel time:25-38min

ZC-44

Brand:Polylite
Appearance:Clear liquid,no visible mechanical impurity
Colour(Hazen):40 Max
Epoxy Equivalent(g/mol):210-230
Hydrolytic Chlorine (%):0.50 Max
Inorg.Cl (mg/kg):50 Max
Volatile /150℃,40min(%):0.6 Max
Softening Point(℃):14-23

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Chemical family:Organic peroxide
CAS number:75-91-2
Physical form:Liquid
Molecular Weight:90.1
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Chemical family:Organic peroxide
CAS number:94-36-0
Physical form:Granular powder
Chemical name:Dibenzoyl peroxide

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Brand:Butanox®
Chemical family:Organic peroxide
CAS number:1338-23-4
Physical form:Liquid
Chemical name:Methyl ethyl ketone peroxide

ZC-638

Brand:Polylite
Appearance: Semi-solid
Epoxy equivalent (g/eq): 170-190
*Hue(G): 3.0Max.
Flash point (℃): 250↑
Solution viscosity (25℃): H~K
Density (g/cm³ 20℃): 1.18

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